Semiconductor light emitting device

ABSTRACT

A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

CROSS-REFERENCE TO THE RELATED APPLICATION

This application claims priority from Korean Patent Application No.10-2018-0117577 filed on Oct. 2, 2018 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND 1. Field

The inventive concept relates to a semiconductor light emitting device,and more particularly, a semiconductor light emitting device capable ofimplementing multicolor.

2. Description of Related Art

A semiconductor light emitting device may have an extended lifespan,lower power consumption, and improved response speeds, while beingeco-friendly, compared to a general light source device. A semiconductorlight emitting device is an important light source device in varioustypes of electronic products such as lighting devices, display devices,and the like.

A related art display device is configured to have a display panelincluding a liquid crystal display (LCD), and a backlight including asemiconductor light emitting device. Recently, semiconductor lightemitting devices in a display device have been used as individual pixelssuch that it may not be necessary to provide a backlight in a displaydevice. Such a display device may be compact in size and may implementhigher brightness with a higher luminous efficiency as compared to arelated art LCD. Further, an aspect ratio of a display screen may bevariously adjusted such that diverse forms of large displays may beimplemented.

SUMMARY

Example embodiment of the inventive concept provide a semiconductorlight emitting device having a plurality of light emitting cells drivenindividually, implementing multicolor, preventing optical interferencebetween the plurality of light emitting cells, and having improved lightextraction efficiency.

According to an example embodiment, there is provided a semiconductorlight emitting device which may include: a plurality of light emittingstructures spaced apart from one another; an isolation layer coveringside surfaces of the plurality of light emitting structures andinsulating the plurality of light emitting structures from one another;a partition layer formed on the isolation layer; a first protectivelayer covering top surfaces of the plurality of light emittingstructures and side walls of the partition layer; a reflective layercovering the first protective layer and disposed on the side walls ofthe partition layer; and a second protective layer covering thereflective layer.

According to an example embodiment, there is provided a semiconductorlight emitting device which may include: a plurality of light emittingstructures spaced apart from one another; an isolation layer insulatingthe plurality of light emitting structures from one another; a partitionlayer formed on the isolation layer and providing a plurality of lightemitting windows respectively corresponding to the plurality of lightemitting structures; and a three-layer reflective structure coveringside walls of the partition layer.

According to an example embodiment, there is provided a semiconductorlight emitting device which may include: a plurality of light emittingstructures; a plurality of wavelength converting layers disposed on theplurality of light emitting structures; a partition layer encapsulatingthe plurality of wavelength converting layers and isolating theplurality of wavelength converting layers from one another; and areflective structure disposed between the plurality of wavelengthconverting layers and the partition layer, and comprising a firstinsulating layer, a reflective layer, and a second insulating layerlayered therein.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the inventiveconcept will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic plan diagram illustrating a semiconductor lightemitting device according to an example embodiment;

FIG. 2 is a schematic cross-sectional diagram taken along line I-I′ inFIG. 1;

FIGS. 3 to 7 are schematic cross-sectional diagrams illustrating asemiconductor light emitting device according to example embodiments;

FIG. 8 is a plan view illustrating a semiconductor light emitting deviceaccording to an example embodiment;

FIGS. 9 and 10 are cross-sectional diagrams taken along lines II-II′ andin FIG. 8, respectively; and

FIGS. 11 to 17 are cross-sectional diagrams illustrating a method ofmanufacturing a semiconductor light emitting device according to anexample embodiment.

DETAILED DESCRIPTION

Hereinafter, example embodiments of the inventive concept will bedescribed with reference to the accompanying drawings.

It will be understood that when an element or layer is referred to asbeing “over,” “above,” “on,” “connected to” or “coupled to” anotherelement or layer, it can be directly over, above, on, connected orcoupled to the other element or layer or intervening elements or layersmay be present. In contrast, when an element is referred to as being“directly over,” “directly above,” “directly on,” “directly connectedto” or “directly coupled to” another element or layer, there are nointervening elements or layers present Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.Spatially relative terms, such as “beneath,” “below,” “lower,” “over,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element's or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. It willbe understood that the spatially relative terms are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. For example, if thedevice in the figures is turned over, elements described as “below” or“beneath” other elements or features would then be oriented “above” theother elements or features. Thus, the term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

FIG. 1 is a schematic plan diagram illustrating a semiconductor lightemitting device according to an example embodiment. FIG. 2 is aschematic cross-sectional diagram taken along line I-I′ in FIG. 1.

Referring to FIGS. 1 and 2, a semiconductor light emitting device 100may include a plurality of light emitting cells A, B, and C, which are afirst light emitting cell A, a second light emitting cell B, and a thirdlight emitting cell C, for example. The first to third light emittingcells A, B, and C may be isolated from one another by a partition layer124 extending in an X direction and a Y direction. The partition layer124 may encapsulate a plurality of wavelength converting layers 128,130, and 132.

The semiconductor light emitting device 100 may include light emittingstructures 110 provided in each of the first to third light emittingcells A, B, and C. The light emitting structures 110 may be spaced apartfrom one another in one direction, in the X direction in FIG. 1, forexample. The first to third light emitting cells A, B, and C may includethe light emitting structures 110 emitting lights having ultravioletwavelengths or blue wavelengths.

The light emitting structure 110 may include a first conductivity-typesemiconductor layer 110 a, an active layer 110 b, and a secondconductivity-type semiconductor layer 110 c. The first conductivity-typesemiconductor layer 110 a may be an N-type semiconductor layer. Thesecond conductivity-type semiconductor layer 110 c may be a P-typesemiconductor layer. The first conductivity-type semiconductor layer 110a and the second conductivity-type semiconductor layer 110 c may beformed of a material including a nitride semiconductor havingcomposition of Al_(x)In_(y)Ga_(1-x-y)N (0≤x<1, 0≤y<1, 0≤x+y<1).

Each of the first conductivity-type semiconductor layer 110 a and thesecond conductivity-type semiconductor layer 110 c may be formed of asingle layer, but may include a plurality of layers having differentdoping concentrations, different compositions, and the like. Each of thefirst conductivity-type semiconductor layer 110 a and the secondconductivity-type semiconductor layer 110 c may use an AlInGaP typesemiconductor or an AlInGaAs type semiconductor rather than the nitridesemiconductor.

The active layer 110 b disposed between the first conductivity-typesemiconductor layer 110 a and the second conductivity-type semiconductorlayer 110 c may emit a light having a predetermined level of energy,generated by recombination of electrons and holes. The active layer 110b may have a multi-quantum well (MQW) structure in which a quantum welllayer and a quantum barrier layer are alternately layered. For example,when a nitride semiconductor is used, the active layer 110 b may have astructure in which an InGaN layer and a GaN layer are alternatelylayered. The active layer 110 b may have a single quantum well (SQW)structure using a nitride semiconductor. The active layer 110 b may emita light having an ultraviolet wavelength or a blue wavelength, forexample, by changing a type or a composition of the material forming theactive layer 110 b.

Each of the light emitting structures 110 may have reflective electrodelayers 114, 116 and pad electrode layers 118, 120 on one surfaces S1thereof. The reflective electrode layers 114 and 116 and the padelectrode layers 118 and 120 may be formed on surfaces below the lightemitting structures 110 as illustrated in FIG. 2. Accordingly, thesemiconductor light emitting device 100 may have a flip-chip structureto be mounted on a board substrate (not illustrated).

The first reflective electrode layer 114 and the second reflectiveelectrode layer 116 may be formed on the one surface S1 of the lightemitting structure 110. The first reflective electrode layer 114 may beelectrically connected to the first conductivity-type semiconductorlayer 110 a, and the second reflective electrode layer 116 may beelectrically connected to the second conductivity-type semiconductorlayer 110 c. The first reflective electrode layer 114 and the secondreflective electrode layer 116 may reflect a light emitted from thelight emitting structure 110. The first reflective electrode layer 114and the second reflective electrode layer 116 may be formed of amaterial having a high reflectivity such as a metal, for example. Eachof the first reflective electrode layer 114 and the second reflectiveelectrode layer 116 may be formed of aluminum (Al), gold (Au), silver(Ag), platinum (Pt), nickel (Ni), chromium (Cr), titanium (Ti), orcopper (Cu).

The first pad electrode layer 118 and the second pad electrode layer 120may be formed below the first reflective electrode layer 114 and thesecond reflective electrode layer 116, respectively. The first padelectrode layer 118 may be electrically connected to the firstreflective electrode layer 114. The second pad electrode layer 120 maybe electrically connected to the second reflective electrode layer 116.The first pad electrode layer 118 may be electrically connected to thefirst conductivity-type semiconductor layer 110 a through the firstreflective electrode layer 114, and the second pad electrode layer 120may be electrically connected to the second conductivity-typesemiconductor layer 110 c through the second reflective electrode layer116.

Each of the first pad electrode layer 118 and the second pad electrodelayer 120 may be formed of a metal, for example. The first pad electrodelayer 118 and the second pad electrode layer 120 may be formed ofaluminum (Al), gold (Au), silver (Ag), platinum (Pt), nickel (Ni),chromium (Cr), titanium (Ti), or copper (Cu).

The semiconductor light emitting device 100 may include an isolationlayer 122 electrically insulating the light emitting structures 110 fromone another, electrically insulating the first reflective electrodelayer 114 and the second reflective electrode layer 116 from each other,and electrically insulating the first pad electrode layer 118 and thesecond pad electrode layer 120 from each other.

The isolation layer 122 may extend from the one surface S1 to the othersurface S2 of the light emitting structure 110. The light emittingstructures 110 may be electrically isolated from one another and drivenindividually by means of the isolation layer 122. In other words, thelight emitting structures 110, which are the first to third lightemitting cells A, B, and C, for example, may be individually driven bymeans of the isolation layer 122. The one surface S1 of the lightemitting structure 110 may be referred to as a bottom surface of thelight emitting structure 110, and the other surface S2 of the lightemitting structure 110 may be referred to as a top surface of the lightemitting structure 110.

The isolation layer 122 may include an isolation insulating layer 112disposed on side surfaces and bottom surfaces of the light emittingstructures 110, and electrically insulating the first reflectiveelectrode layer 114 and the second reflective electrode layer 116 fromeach other, and a mold insulating layer 121 electrically insulating thefirst pad electrode layer 118 and the second pad electrode layer 120from each other.

The isolation insulating layer 112 may be formed of a silicon oxidelayer or a silicon nitride layer. The mold insulating layer 121 may beformed of silicone resin, epoxy resin, or acrylic resin. A bottomsurface of the mold insulating layer 121 may be coplanar with bottomsurfaces of the pad electrode layers 118 and 120.

The other surfaces S2 of the light emitting structures 110, the topsurfaces, for example, may have uneven structures 208 formed therein. Afirst protective layer 127 may be formed on the top surfaces of thelight emitting structures 110 having the uneven structures 208. When thesemiconductor light emitting device 100 is manufactured, the othersurface S1 of the light emitting structure 110, which is a lightemitting surface, may be protected by the first protective layer 127such that light extraction efficiency may improve. Also, when thesemiconductor light emitting device 100 is manufactured, the unevenstructure 208 may not be damaged due to the first protective layer 127,and light extraction efficiency may thus improve. In the semiconductorlight emitting device 100, the undamaged uneven structure 208 may beformed on the other surface S2 of the light emitting structure 110,which is a light emitting surface, for example, and light extractionefficiency may accordingly improve. Alternatively, in the exampleembodiment, the uneven structure 208 may not be formed on the topsurfaces of the light emitting structures 110. The first protectivelayer 127 may be formed of a silicon oxide layer or a silicon nitridelayer. A thickness of the first protective layer 127 covering the topsurfaces of the light emitting structures 110 may be 100 nm or greaterdesirably.

A plurality of wavelength converting layers 128, 130 and 132 emittinglights having different colors may respectively be formed on the firstprotective layers 127 in the light emitting structures 110. The firstwavelength converting layer 128 may emit blue light, the secondwavelength converting layer 130 may emit green light, and the thirdwavelength converting layer 132 may emit red light. The plurality ofwavelength converting layers 128, 130 and 132 may be formed of a resinlayer containing a phosphor or a quantum dot (a nanophosphor). At leastone of the plurality of wavelength converting layers 128, 130 and 132may be formed of a transparent resin layer which does not includephosphor or a quantum dot, and may emit blue light from the lightemitting structure 110. For example, the wavelength converting layers128 may be formed of a transparent resin layer which does not includephosphor or a quantum dot. Wavelength filter layers and/or wavelengthreflective layers may be formed on the plurality of wavelengthconverting layers 128, 130 and 132. The wavelength filter layers maypass certain wavelength ranges, such as red, green and blue spectralranges, respectively, which pass through the wavelength convertinglayers 128, 130 and 132 and are emitted, and may improve colorreproducibility of a display device. The wavelength reflective layersmay reflect a light in a certain wavelength range which enters theplurality of wavelength converting layers 128, 130 and 132 from theoutside. As the light emitting structures 110 are electrically isolatedfrom one another and driven individually, the semiconductor lightemitting device 100 may represent a variety of colors if desired.

A partition layer 124 may be disposed between the plurality ofwavelength converting layers 128, 130 and 132 such that the plurality ofwavelength converting layers 128, 130 and 132 may be isolated from oneanother. The partition layer 124 may provide a plurality of lightemitting windows respectively corresponding to the plurality of lightemitting structures 110, and may be integrally formed such that portionsof the partition layer 124, respectively isolating the wavelengthconverting layers 128, 130 and 132 from one another, are connected toone another. The plurality of wavelength converting layers 128, 130 and132 may respectively be disposed in the plurality of light emittingwindows. The partition layer 124 may encapsulate the plurality ofwavelength converting layers 128, 130 and 132 on a planar surface. Theplurality of wavelength converting layers 128, 130 and 132 may beisolated from one another by the partition layer 124, and mayrespectively be disposed on the top surfaces of the light emittingstructures 110. A height of the partition layer 124 may be within arange of 30 μm to 150 μm. A width of the partition layer 124 may bewithin a range of 10 μm to 30 μm.

The partition layer 124 may be disposed on the isolation layer 122between the light emitting structures 110. The partition layer 124 maybe in contact with the isolation layer 122. The partition layer 124 maybe in contact with the isolation insulating layer 112.

The partition layer 124 may be formed of a semiconductor material, ametal material, or an insulating material. The semiconductor materialmay include silicon (S1), silicon carbide (SiC), and the like. The metalmaterial may be aluminum (Al), gold (Au), silver (Ag), platinum (Pt),nickel (Ni), chromium (Cr), titanium (Ti), or copper (Cu), or alloysthereof. The metal material may be formed of a plating layer, forexample. The insulating material may include Al₂O₃, MgAl₂O₄, MgO,LiAlO₂, LiGaO₂, resin (silicone, epoxy), and the like. The resin mayinclude titanium oxide or other reflective materials therein. The resinmay appear gray or black in color to absorb light from the outside. Inthe example embodiment, the partition layer 124 may be coated with amaterial appearing gray or black to absorb light from the outside.Accordingly, when a screen of a display device is turned off, an entirescreen may appear black.

The semiconductor light emitting device 100 may include a reflectivelayer 404 disposed on side walls of the partition layer 124. The firstprotective layer 127 may extend into spaces between the side walls ofthe partition layers 124 and the reflective layers 404 from the topsurfaces of the light emitting structures 110 and cover the side wallsof the partition layers 124. The reflective layer 404 may cover thefirst protective layer 127 and may be disposed on the side walls of thepartition layer 124. The first protective layer 127 may extend from theside walls of the partition layer 124 and cover a top surface of thepartition layer 124. The first protective layer 127 may cover the topsurface and the side walls of the partition layer 124, and may alsocover the light emitting surfaces of the light emitting structures 110.

The reflective layer 404 may reflect light emitted from the lightemitting structure 110. The reflective layer 404 may be a metal layer, aresin layer containing a metal oxide, or a distributed Bragg reflectorlayer. A thickness of the reflective layer 404 covering side walls ofthe light emitting structures 110 may be 100 nm or greater desirably.Specifically, a thickness of the reflective layer 404 covering the sidewalls of the light emitting structures 110 may be within a range of 100nm to 500 nm.

The metal layer may be aluminum (Al), gold (Au), silver (Ag), platinum(Pt), nickel (Ni), chromium (Cr), titanium (Ti), or copper (Cu). Theresin layer containing a metal oxide may be a resin layer containingtitanium oxide. In the distributed Bragg reflector layer, a plurality ofinsulating layers having different refractive indexes may be alternatelylayered in several to hundreds layers, for example, in two to onehundred layers. The insulating layers forming the distributed Braggreflector layer may be formed of oxide or nitride such as SiO₂, SiN,SiOxNy, TiO₂, S1 ₃N₄, Al₂O₃, TiN, AN, ZrO₂, TiAlN, TiSiN, orcompositions thereof. Accordingly, light extraction efficiency of thesemiconductor light emitting device 100 may improve due to thereflective layer 404 disposed on the side walls of the partition layer124.

The semiconductor light emitting device 100 may include a secondprotective layer 406 covering the reflective layer 404 disposed on theside walls of the partition layer 124. The second protective layer 406may prevent damage to the reflective layer 404 or prevent by-productsgenerated from etching from being formed on a surface of the reflectivelayer 404 during an etching process for forming the reflective layer 404on the side walls of the partition layer 124, thereby preventingdegradation of a reflectivity of the reflective layer 404. A thicknessof the second protective layer 406 at the side walls of the partitionlayer 124 may be lower than a thickness of the first protective layer127. The second protective layer 406 may be formed of a silicon oxidelayer or a silicon nitride layer. A thickness of the second protectivelayer 406 covering the reflective layer 404 may preferably be 100 nm orgreater. Specifically, a thickness of the second protective layer 406covering the reflective layer 404 may be within a range of 100 nm to 500nm.

For example, in the case in which the reflective layer 404 is formed ofaluminum, the reflective layer 404 formed on the side walls of thepartition layer 124 may be corroded by Cl₂ gas during an etchingprocess. Also, a by-product generated from etching, such as aluminumchloride (AlCl₃), and the like, may be formed on a surface of thereflective layer 404 formed on the side walls of the partition layer124. By forming the second protective layer 406 covering the reflectivelayer 404 before an etching process, corrosion of the reflective layer404 or formation of by-products on a surface of the reflective layer 404occurring during an etching process may be prevented.

A three-layer reflective structure including the first protective layer127, the reflective layer 404, and the second protective layer 406,layered in order, may be disposed on side walls of the partition layer124 of the semiconductor light emitting device 100. Accordingly, thesemiconductor light emitting device 100 may represent multicolor whilepreventing optical interference between the light emitting cells A, B,and C and improving light extraction efficiency.

FIGS. 3 to 7 are schematic cross-sectional diagrams illustrating asemiconductor light emitting device according to example embodiments.FIGS. 3 to 7 illustrate regions corresponding to FIG. 2.

Referring to FIG. 3, in a semiconductor light emitting device 100A, areflective layer 404 may cover a first protective layer 127 on a topsurface of a partition layer 124 differently from the semiconductorlight emitting device 100 in FIG. 2. Apart from the difference describedabove, the configuration of the semiconductor light emitting device 100Amay be the same as the configuration of the semiconductor light emittingdevice 100 in FIG. 2.

Referring to FIG. 4, in a semiconductor light emitting device 100B, areflective layer 404 may cover a first protective layer 127 on a topsurface of a partition layer 124, and a second protective layer 406 maycover the reflective layer 404 on a top surface of the partition layer124, differently from the semiconductor light emitting device 100 inFIG. 2. Apart from the differences described above, the configuration ofthe semiconductor light emitting device 100B may be the same as theconfiguration of the semiconductor light emitting device 100 in FIG. 2.

Referring to FIG. 5, in a semiconductor light emitting device 100C, anisolation layer 122 may be inserted into a lower portion of a partitionlayer 124 differently from the semiconductor light emitting device 100in FIG. 2. Apart from the difference described above, the configurationof the semiconductor light emitting device 100C may be the same as theconfiguration of the semiconductor light emitting device 100 in FIG. 2.

Referring to FIG. 6, a semiconductor light emitting device 100D mayinclude an isolation layer 122-1 electrically insulating light emittingstructures 110 from one another differently from the semiconductor lightemitting device 100 in FIG. 2.

The isolation layer 122-1 may include an isolation insulating layer 112covering side surfaces and bottom surfaces of the light emittingstructures 110 and electrically insulating reflective electrode layers114 and 116 from each other, a metal layer 113 covering side surfaces ofthe light emitting structures 110 and electrically insulated from thelight emitting structures 110 by the isolation insulating layer 112, anda mold insulating layer 121 covering the isolation insulating layer 112and the metal layer 113 and electrically insulating pad electrode layers118 and 120 from each other. Apart from the differences described above,the configuration of the semiconductor light emitting device 100D may bethe same as the configuration of the semiconductor light emitting device100 in FIG. 2.

Referring to FIG. 7, in a semiconductor light emitting device 100E, sidewalls of a partition layer 124-1 may have slopes such that a width ofthe partition layer 124-1 decreases upwardly. A width of an upperportion of the partition layer 124-1 may be smaller than a width of alower portion of the partition layer 124-1. By including the partitionlayer 124-1 having the sloped side walls, light extraction efficiency ofthe semiconductor light emitting device 100E may improve.

FIG. 8 is a plan view illustrating a semiconductor light emitting device300 according to an example embodiment. FIGS. 9 and 10 arecross-sectional diagrams taken along lines II-II′ and III-III′ in FIG.8, respectively. Apart from the configuration in which the semiconductorlight emitting device 300 in FIGS. 8 to 10 includes four light emittingcells A, B, C, and D, the configuration of the semiconductor lightemitting device 300 in FIGS. 8 to 10 may be the same as theconfiguration of the semiconductor light emitting device 100 in FIGS. 1and 2. FIG. 9 illustrates the first light emitting cell A and the fourthlight emitting cell D, and FIG. 10 illustrates the second light emittingcell B and the fourth light emitting cell C.

The semiconductor light emitting device 300 may include the four lightemitting cells A, B, C, and D, which are the first light emitting cellA, the second light emitting cell B, a third light emitting cell C, andthe fourth light emitting cell D. The first light emitting cell A andthe second light emitting cell B may be spaced apart from each other inan X direction, and the third light emitting cell C and the fourth lightemitting cell D may also be spaced apart from each other in the Xdirection. The third light emitting cell C may be spaced apart from thefirst light emitting cell A in a Y direction, and the fourth lightemitting cell D may be spaced apart from the second light emitting cellB in the Y direction. The arrangement of the first light emitting cellA, the second light emitting cell B, the third light emitting cell C,and the fourth light emitting cell D may vary if desired.

In FIG. 8, the light emitting cells A, B, C, and D may be isolated fromone another by a partition layer 124 extending in both of the Xdirection and the Y direction. The partition layer 124 may encapsulatewavelength converting layers 128, 130, 132, and 134.

In the semiconductor light emitting device 300, each of the lightemitting cells A, B, C, and D may include a light emitting structure110. The light emitting cells A, B, C, and D may include the lightemitting structures 110 emitting a light having an ultravioletwavelength or a blue wavelength. The light emitting structure 110 mayinclude a first conductivity-type semiconductor layer 110 a, an activelayer 110 b, and a second conductivity-type semiconductor layer 110 c.

Pad electrode layers 118 and 120 may be formed on one surfaces of thelight emitting structures 110, which are bottom surfaces of the lightemitting structure 110, for example. Accordingly, the semiconductorlight emitting device 300 may have a flip ship structure and be mountedon a board substrate (not illustrated).

A first reflective electrode layer 114 and a second reflective electrodelayer 116 may be disposed on the first pad electrode layer 118 and thesecond pad electrode layer 120. The first reflective electrode layer 114and the second reflective electrode layer 116 may be electricallyconnected to the first conductivity-type semiconductor layer 110 a andthe second conductivity-type semiconductor layer 110 c, respectively.

In the semiconductor light emitting device 300, an isolation layer 122may be formed between the light emitting structures 110 to insulate thelight emitting structures 110 from one another, and may be formedbetween the reflective electrode layers 114 and 116 and between the padelectrode layers 118 and 120 to insulate the reflective electrode layers114 and 116 from each other and the pad electrode layers 118 and 120from each other. The isolation layer 122 may include an isolationinsulating layer 112 covering side surfaces and bottom surfaces of thelight emitting structures 110 and electrically insulating the reflectiveelectrode layers 114 and 116 from each other, and a mold insulatinglayer 121 covering the isolation insulating layer 112 and electricallyinsulating the pad electrode layers 118 and 120 from each other. In thesemiconductor light emitting device 300, the light emitting structures110 may be electrically isolated from one another and drivenindividually by means of the isolation layer 122. By the isolation layer122, the light emitting structures 110 may be divided into a first lightemitting cell A, a second light emitting cell B, a third light emittingcell C, and a fourth light emitting cell D, for example.

In the semiconductor light emitting device 300, a plurality ofwavelength converting layers 128, 130, 132, and 134 emitting lightshaving different colors may respectively be formed on the other surfacesS2 of the light emitting structures 110, which is top surfaces of thelight emitting structures 110, for example. The plurality of wavelengthconverting layers 128, 130, 132, and 134 may be isolated from oneanother by the partition layer 124 and may be disposed on the topsurfaces of the light emitting structures 110, respectively. The firstwavelength converting layer 128 may emit blue light, the secondwavelength converting layer 130 may emit green light, the thirdwavelength converting layer 132 may emit red light, and the fourthwavelength converting layer 134 may emit white light. The plurality ofwavelength converting layers 128, 130, 132, and 134 may be formed ofresin layers containing phosphor or a quantum dot (a nanophosphor). Thelight emitting structures 110 may be electrically isolated from oneanother and driven individually, and accordingly, the semiconductorlight emitting device 300 may represent a variety of colors if desired.

A three-layer reflective structure including the first protective layer127, the reflective layer 404, and the second protective layer 406,layered in order, may be disposed on side walls of the partition layer124 of the semiconductor light emitting device 300.

Accordingly, the semiconductor light emitting device 300 may representmulticolor while preventing optical interference among the lightemitting cells A, B, C, and D and improving light extraction efficiency.

FIGS. 11 to 17 are cross-sectional diagrams illustrating a method ofmanufacturing a semiconductor light emitting device according to anexample embodiment.

Referring to FIG. 11, a light emitting structure 110 including a firstconductivity-type semiconductor layer 110 a, an active layer 110 b, anda second conductivity-type semiconductor layer 110 c may be formed on asubstrate 101. An isolation groove 109 isolating light emitting cells A,B, and C from one another may be formed by etching a partial region ofthe light emitting structure 110. In other words, the isolation groove109 dividing the light emitting structures 110 into the first lightemitting cell A, the second light emitting cell B, and the third lightemitting cell C may be formed.

An isolation insulating layer 112 having exposure holes 111 which exposea portion of the light emitting structure 110 may be formed on innerwalls of the isolation groove 109 and on the light emitting structure110. The exposure holes 111 may include a first sub-exposure hole 111 aand a second sub-exposure hole 111 b. The isolation insulating layer 112may be formed of a silicon oxide layer or a silicon nitride layer. Theisolation insulating layer 112 may be formed on side walls and onesurface S1 of the light emitting structure 110. The first sub-exposurehole 111 a may expose the first conductivity-type semiconductor layer110 a, such as an N-type semiconductor layer, for example. The secondsub-exposure hole 111 b may expose the second conductivity-typesemiconductor layer 110 c, such as a P-type semiconductor layer, forexample.

Reflective electrode layers 114 and 116 may be formed in the exposureholes 111. The first reflective electrode layer 114 and the secondreflective electrode layer 116 may be formed in the first sub-exposurehole 111 a and the second sub-exposure hole 111 b, respectively. Thereflective electrode layers 114 and 116 may be formed of a materialhaving a high reflectivity, such as a metal layer, for example. Thereflective electrode layers 114 and 116 may be formed of aluminum (Al),gold (Au), silver (Ag), platinum (Pt), nickel (Ni), chromium (Cr),titanium (Ti), or copper (Cu). The reflective electrode layers 114 and116 may reflect light emitted from the light emitting structure 110 andmay serve as an electrode layer. The reflective electrode layers 114 and116 may respectively be formed on the one surfaces S1 of the lightemitting structures 110.

Referring to FIG. 12, pad electrode layers 118 and 120 may be formed onthe reflective electrode layers 114 and 116. In other words, the firstpad electrode layer 118 and the second pad electrode layer 120 may beformed on the first reflective electrode layer 114 and the secondreflective electrode layer 116, respectively. The first pad electrodelayer 118 may be electrically connected to the first conductivity-typesemiconductor layer 110 a, and the second pad electrode layer 120 may beelectrically connected to the second conductivity-type semiconductorlayer 110 c. The first pad electrode layer 118 and the second padelectrode layer 120 may be formed of the same material as the materialof the first reflective electrode layer 114 and the second reflectiveelectrode layer 116. Through the processes described above, the padelectrode layers 118 and 120 and the reflective electrode layers 114 and116 may be formed on each of the one surfaces S1 of the light emittingstructures 110.

Thereafter, a mold insulating layer 121 electrically insulating the padelectrode layers 118 and 120 from each other and electrically insulatingthe light emitting structures 110 from one another may be formed. Themold insulating layer 121 may be integrally formed such that portions ofthe mold insulating layer 121, respectively insulating the lightemitting structures 110 from one another, are connected to one another.The mold insulating layer 121 may be formed of silicone resin, epoxyresin, or acrylic resin. A surface of the mold insulating layer 121 maybe coplanar with surfaces of the pad electrode layers 118 and 120.Through the processes described above, the isolation insulating layer112 and the mold insulating layer 121 may form the isolation layer 122electrically isolating the light emitting cells A, B, and C from oneanother.

Referring to FIG. 13, a temporary substrate 123 may be attached to thepad electrode layers 118 and 120 and the isolation layer 122. Thetemporary substrate 123 may support the pad electrode layers 118 and 120and the isolation layer 122. The temporary substrate 123 may be a glasssubstrate, an insulating substrate, or the like.

The temporary substrate 123 may face downwardly, and the substrate 101may be ground to reduce a thickness of the substrate 101.

Referring to FIG. 14, a partition layer 124 having exposure holes 126which expose the other surfaces S2 of light emitting structures 110 maybe formed by etching a partial region of the substrate 101. The exposureholes 126 may include a first sub-exposure hole 126 a, a secondsub-exposure hole 126 b, and a third sub-exposure hole 126 crespectively formed in the light emitting cells A, B, and C. The firstsub-exposure hole 126 a, the second sub-exposure hole 126 b, and thethird sub-exposure hole 126 c may be a first light emitting window, asecond light emitting window, and a third light emitting window,respectively. The partition layer 124 may be integrally formed. Thepartition layer 124 may be formed of a semiconductor material or aninsulating material depending on the substrate 101.

As the partition layer 124 in the example embodiment is formed of aportion of the substrate 101, an additional formation process may not benecessary. Thus, a manufacturing process may be simplified, and a heightof the partition layer 124 may be easily adjusted.

A uneven structure 208 may be formed on the other surfaces S2 of thelight emitting structures 110 exposed through the exposure holes 126. Inthe example embodiment, the uneven structure 208 may not be formed ifdesired.

A first protective layer 127 may be formed on the other surfaces S2 ofthe light emitting structures 110 and a top surface and side surfaces ofthe partition layer 124. The first protective layer 127 may be formed toprotect the other surfaces S2 of the light emitting structures 110,which are light emitting surfaces, during a subsequent process.Thereafter, a light reflecting material layer 404 a may be formed on thefirst protective layer 127. The light reflecting material layer 404 amay be formed of the same material as the material of the reflectivelayer 404 described above. A second protective material layer 406 a maybe formed on the light reflecting material layer 404 a. The secondprotective material layer 406 a may be formed of the same material asthe material of the second protective layer 406 described above.

Referring to FIG. 15, a reflective layer 404 and a second protectivelayer 406 may be formed by etching a light reflecting material layer 404a and a second protective material layer 406 a. When the lightreflecting material layer 404 a and the second protective material layer406 a are etched, the light reflecting material layer 404 a and thesecond protective material layer 406 a formed on the other surface S2 ofthe light emitting structure 110 and on the top surface of the partitionlayer 124 may be removed. The reflective layer 404 and the secondprotective layer 406 may be formed on side walls of the partition layer124. Through the processes described above, the first protective layer127, the reflective layer 404, and the second protective layer 406,layered in order, may be formed on the side walls of the partition layer124.

In the example embodiment, when the light reflecting material layer 404a and the second protective material layer 406 a are etched, the secondprotective material layer 406 a and the light reflecting material layer404 a formed on the other surface S2 of the light emitting structure 110may be removed, and the second protective material layer 406 a formed onthe top surface of the partition layer 124 may be removed. The lightreflecting material layer 404 a formed on the top surface of thepartition layer 124 may remain. The reflective layer 404 may be formedon the top surface and side walls of the partition layer 124, and thesecond protective layer 406 may be formed on the side walls of thepartition layer 124. Through the processes described above, the firstprotective layer 127, the reflective layer 404, and the secondprotective layer 406, layered in order, may be formed on the side wallsof the partition layer 124, and the first protective layer 127 and thereflective layer 404 may be formed on the top surface of the partitionlayer 124.

In the example embodiment, when the light reflecting material layer 404a and the second protective material layer 406 a are etched, the secondprotective material layer 406 a and the light reflecting material layer404 a formed on the other surface S2 of the light emitting structure 110may be removed, and the second protective material layer 406 a and thelight reflecting material layer 404 a formed on the top surface of thepartition layer 124 may remain. The reflective layer 404 and the secondprotective layer 406 may be formed on the top surface and the side wallsof the partition layer 124. Through the processes described above, thefirst protective layer 127, the reflective layer 404, and the secondprotective layer 406, layered in order, may be formed on the side wallsand the top surface of the partition layer 124.

Referring to FIG. 16, wavelength converting layers 128, 130 and 132 mayrespectively be formed on first protective layers 127 in exposure holes126 on light emitting structures 110. The first wavelength convertinglayer 128, the second wavelength converting layer 130, and the thirdwavelength converting layer 132 may be formed in a first sub-exposurehole 126 a, a second sub-exposure hole 126 b, and a third sub-exposurehole 126 c, respectively. A temporary substrate 123 may be removedthereafter.

Referring to FIG. 17, a first protective layer 127, a partition layer124, and an isolation layer 122 may be cut along a cutout line 136 toinclude a plurality of light emitting cells A, B, and C, and asemiconductor light emitting device 100 may be manufactured.

According to the aforementioned example embodiments, by including theisolation layer isolating the plurality of light emitting cells from oneanother, which are driven individually, and the partition layer disposedon the isolation layer, and forming the first protective layer, thereflective layer, and the second protective layer in order on side wallsof the partition layer in the semiconductor light emitting device, thesemiconductor light emitting device may represent multicolor, opticalinterference among the plurality of light emitting cells may beprevented, and light extraction efficiency may improve.

While the example embodiments have been shown and described above, itwill be apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of theinventive concept as defined by the appended claims.

1. A semiconductor light emitting device, comprising: a plurality oflight emitting structures; an isolation layer covering side surfaces ofthe plurality of light emitting structures and insulating the pluralityof light emitting structures from one another; a partition layer formedon the isolation layer; a first protective layer covering top surfacesof the plurality of light emitting structures and side walls of thepartition layer; a reflective layer covering the first protective layerand disposed on the side walls of the partition layer; and a secondprotective layer covering the reflective layer.
 2. The semiconductorlight emitting device of claim 1, wherein the first protective layercovers a top surface of the partition layer.
 3. The semiconductor lightemitting device of claim 2, wherein the reflective layer covers thefirst protective layer on the top surface of the partition layer.
 4. Thesemiconductor light emitting device of claim 3, wherein the secondprotective layer covers the reflective layer on the top surface of thepartition layer.
 5. The semiconductor light emitting device of claim 1,further comprising a plurality of wavelength converting layers isolatedfrom one another by the partition layer, respectively disposed on thetop surfaces of the plurality of light emitting structures, and emittinglights having different colors.
 6. The semiconductor light emittingdevice of claim 5, wherein the partition layer is integrally formed suchthat portions of the partition layer, respectively isolating thewavelength converting layers from one another, are connected to oneanother.
 7. The semiconductor light emitting device of claim 1, whereinthe partition layer is formed of a semiconductor material or aninsulating material.
 8. The semiconductor light emitting device of claim1, wherein the top surfaces of the plurality of light emittingstructures have uneven structures, and the first protective layer coverseach of the uneven structures.
 9. The semiconductor light emittingdevice of claim 1, wherein the isolation layer is integrally formed suchthat portions of the isolation layer, respectively insulating theplurality of light emitting structures from one another, are connectedto one another.
 10. The semiconductor light emitting device of claim 1,wherein the isolation layer comprises: an isolation insulating layercovering side surfaces and bottom surfaces of the plurality of lightemitting structures; and a mold insulating layer covering the isolationinsulating layer, and wherein a portion of the isolation insulatinglayer is in contact with the partition layer.
 11. The semiconductorlight emitting device of claim 1, wherein the isolation layer comprises:an isolation insulating layer covering side surfaces and bottom surfacesof the plurality of light emitting structures; a metal layer coveringside surfaces of the plurality of light emitting structures andelectrically insulated from the plurality of light emitting structuresby the isolation insulating layer; and a mold insulating layer coveringthe isolation insulating layer and the metal layer.
 12. Thesemiconductor light emitting device of claim 1, wherein the side wallsof the partition layer has a slope such that a width of the partitionlayer decreases upwardly.
 13. The semiconductor light emitting device ofclaim 1, wherein the isolation layer is inserted into a lower portion ofthe partition layer.
 14. The semiconductor light emitting device ofclaim 1, wherein the reflective layer is formed of a metal material, aresin layer containing a metal oxide, or a distributed Bragg reflectorlayer.
 15. A semiconductor light emitting device, comprising: aplurality of light emitting structures; an isolation layer insulatingthe plurality of light emitting structures from one another; a partitionlayer formed on the isolation layer and providing a plurality of lightemitting windows respectively corresponding to the plurality of lightemitting structures; and a three-layer reflective structure coveringside walls of the partition layer.
 16. The semiconductor light emittingdevice of claim 15, wherein the reflective structure comprises: a firstprotective layer covering side walls of the partition layer; areflective layer covering the first protective layer and disposed on theside walls of the partition layer; and a second protective layercovering the reflective layer.
 17. The semiconductor light emittingdevice of claim 16, further comprising a plurality of wavelengthconverting layers respectively disposed in the plurality of lightemitting windows, and emitting lights having different colors, whereinthe partition layer is integrally formed such that portions of thepartition layer, respectively isolating the wavelength converting layersfrom one another, are connected to one another, and wherein theisolation layer is integrally formed such that portions of the isolationlayer, respectively insulating the plurality of light emittingstructures from one another, are connected to one another.
 18. Thesemiconductor light emitting device of claim 17, wherein the firstprotective layer extends into spaces between the plurality of lightemitting structures and the plurality of wavelength converting layersand covers the plurality of light emitting structures. 19-22. (canceled)23. A semiconductor light emitting device, comprising: a plurality oflight emitting structures; a plurality of wavelength converting layersdisposed on the plurality of light emitting structures; a partitionlayer encapsulating the plurality of wavelength converting layers andisolating the plurality of wavelength converting layers from oneanother; and a reflective structure disposed between the plurality ofwavelength converting layers and the partition layer, and comprising afirst insulating layer, a reflective layer, and a second insulatinglayer layered therein.
 24. (canceled)
 25. The semiconductor lightemitting device of claim 23, wherein the first insulating layer covers atop surface of the partition layer, and the reflective layer covers thefirst insulating layer on the top surface of the partition layer. 26-27.(canceled)